Afterwards, there will be a stage of cool-down. Then, the bottom of the board is passed through a molten solder wave (looks like a smooth waterfall only consisting of molten solder). After the flux, the board will usually pass a pre-heater to activite the flux and pre-heat the board for the soldering. Typically the first step in the wave solder, the bottom of the board passes through a fluxing operation which either sprays flux on the bottom or passes the bottom of the board through a flux foam. A pump in the frying pan develops a 'wave' of solder that cleans over the board, soldering the parts to the board. It functions by passing each circuit card over a frying pan of liquified solder. THEN the board is placed in the wave soldering machine. Swing soldering is a mass soldering procedure that makes it possible for one to make numerous circuit boards in an extremely brief quantity of time. In wave soldering, the components are placed on the board. In reflow soldering, we make a solder paste out of powdered solder and flux, then use that paste to attach components to contact pads. Although it’s possible to use reflow soldering for this purpose, it rarely is since wave soldering is more cost effective. The oven is setup so the components receive as little thermal shock as possible, and spend only a few seconds above the solder melting temperature. Wave soldering is more frequently used for soldering through-hole components. The reflow oven will have several heating zones designed to preheat, activate the flux, reflow the solder, and cool the board. The board is then passed through a reflow oven at which time, the solder paste melts to complete the soldering of the components to the circuit board. The solder paste operation is done BEFORE adding the components to the board. This means that the internal environment in a wave solder oven is far more sensitivea small change in temperature or conditions might result in catastrophic damage to the PCBs.
The solder paste contains both a solder flux and the solder in the form of minute solder balls. Reflow soldering uses hot air, while wave soldering uses a 'wave' of solder to mass-produce PCBs. In reflow soldering, the solder is applied as a 'solder paste' typically by using a stencil mask and a squeege. Additional differences between reflow and wave soldering.
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